High Temperature Memory Devices
High Temperature Memory Devices For over 30 years Texas Microelectronics Corporation (TxMC) has successfully utilized various memory dies that successfully...
Read More
High Temperature DC-DC Converters
High Temperature DC-DC Converters May 2023 Over the last 30 years we at Texas Microelectronics Corporation (TxMC) have solidified ourselves...
Read More
Wire Bond Pull Testing – Not a “Random” Process for Us
Wire Bond Pull Testing – Not a “Random” Process for Us December 2022 Wire Bond Pull Testing is not...
Read More
The Venerable OP284
The Venerable OP284 October 2022 OP-AMPS are a widely used component in many sensor heavy industries including Oil &...
Read More
Limitations with Semiconductor Plastic Packages
Limitations with Semiconductor Plastic Packages July 2022 Decades ago the overwhelming majority of commercial semiconductors were packaged in ceramic packages....
Read More
6 Top Benefits of Hybrid Microelectronic Technology
6 Top Benefits of Hybrid Microelectronic Technology June 2022 High Temperature Operation: The absence of plastic packaging used in traditional...
Read More
Die-Level Semiconductor Programming
Die-Level Semiconductor Programming May 2022 Field Programmable Gate Arrays (FPGA), EPROM, EEPROM, FLASH: Texas Microelectronics Corporation has the ability to...
Read More
The Semiconductor Shortage – The 3 Why’s
The Semiconductor Shortage – The 3 Why's April 2022 "Semiconductor shortage". It's a phrase that is becoming more common in...
Read More