Services

  • Engineering / Design
    Engineering / Design
  • Engineering / Design
    Engineering / Design
    At Texas Microelectronics Corporation, our engineering staff is available to assist you throughout the entire design cycle, from concept to completion. DESIGN ASSISTANCE: Texas Microelectronics Corporation stands ready to assist you in your microelectronic design concerns including die availability, environmental performance of various die manufacturers, and manufacturing issues involving the implementation of your circuit design into a microelectronic assembly. COMPLETE TURN-KEY ENGINEERING SOLUTIONS: Provide us your functional and environmental specifications and our engineers will evaluate, conceive, and suggest a microelectronic product that meets your requirements. This includes new products, redesigns, and replacements for discontinued semiconductor components.
    ISO 9001:2015 Certificate
  • Prototyping
    Prototyping
  • Prototyping
    Prototyping
    Texas Microelectronics Corporation excels at taking customer requirements and translating them into a physical form. We work closely with our clients to develop and verify the design before having to commit to the purchase of costly items such as semiconductor die, substrates and custom packages. TxMC can help identify and resolve potential design and manufacturing issues early in the development process. With over 25 years of experience, TxMC has the ability to offer highly cost effective real world solutions that can help make your products transition from a concept to reality seamless.
    ISO 9001:2015 Certificate
  • Obsolescence Solutions
    Obsolescence Solutions
  • Obsolescence Solutions
    Obsolescence Solutions
    DEVICE EMULATION: Texas Microelectronics Corporation has provided solutions for customers faced with board or system redesigns due to a discontinued semiconductor component. In most cases, a single PGA can be used to emulate the discontinued component and then packaged as a direct plug in replacement. For high density and mixed signal components, PGA’s in unification with additional support circuitry can be utilized to provide a solution that requires no redesign. Disappearing high temperature semiconductors can lead to expensive redesigns. Many semiconductor manufacturers no longer offer parts in ceramic packages. In many cases we can offer pin for pin compatible parts in hermetically sealed packages. Gate array die can be programmed and used to emulate discontinued components and then packaged as a direct plug in replacement.
    ISO 9001:2015 Certificate
  • Screening / Testing
    Screening / Testing
  • Screening / Testing
    Screening / Testing
    ENVIRONMENTAL ELECTRICAL TESTING FROM -65 C TO 240 C. All microelectronic designs can be manufactured and tested at commercial, industrial, and military temperature ranges. DEVICE BURN-IN: Static or dynamic device burn-in is accomplished following MIL-STD 883 procedures. FULL DEVICE SCREENING: Complete MIL standard screening procedures for microelectronics are employed for each device produced. Texas Microelectronics Corporation will adhere to your electrical test and screening specifications. If asked, Texas Microelectronics Corporation will offer suggested testing protocols.
    ISO 9001:2015 Certificate
  • Packaging / Assembly
    Packaging / Assembly
  • Packaging / Assembly
    Packaging / Assembly
    MICROELECTRONIC DESIGN, INTEGRATION, AND PACKAGING: At Texas Microelectronics Corporation, you have a variety of packaging options for your design which include, but are not limited to, ceramic, metal, plastic packages (DIP, CLCC, PLCC, CPGA, MCM, PGA, etc.), or Chip-On-Board. Virtually any package size and shape is possible. Including: Gold Plated Kovar, Ceramic Packages, Custom Packages, Kovar, Silicon Carbide/Aluminum, Connectors: Machined or Braised
    ISO 9001:2015 Certificate
  • Die Level Programming
    Die Level Programming
  • Die Level Programming
    Die Level Programming
    PROGRAMMABLE GATE ARRAYS (PGA), EPROM, EEPROM, FLASH: Texas Microelectronics Corporation has the ability to program PGA’s and most memory devices at the die level, before insertion into the package. This procedure provides the distinct advantage of reducing the total pin count to power and I/O only. The die’s programming pins need not be connected to the package itself unless your design specifically requires them. PGA and memory die can be placed in various package pin counts dependent upon die size and I/O width. These die may be packaged in a monolithic configuration or incorporated with other die as part of a true microelectronic circuit. For high density and mixed signal components, die level programming, with additional support circuitry can be utilized to provide a solution without redesigning the entire tool.
    ISO 9001:2015 Certificate
  • Wirebonding
    Wirebonding
  • Wirebonding
    Wirebonding
    Texas Microelectronics Corporation offers manual and automatic wire bonding services to accommodate a variety of wire bonding applications. Our capabilities include gold ball bonding 1.25 mil to 3 mil diameter wire, manual aluminum wedge bonding from 0.75 mil to 20 mil in diameter wire, and automatic wedge bonding with either gold or aluminum wire.
    ISO 9001:2015 Certificate
  • Quality
    Quality
  • Quality
    Quality
    Texas Microelectronics Corporation takes quality and continuous process improvement very seriously. Our products are used in some of the most extreme and demanding environments imaginable. TxMC has dedicated itself to producing products of the highest quality and reliability. We offer our customers a 2 year limited warranty on all of our products. TxMC is committed to manufacturing products that meet or exceed all customer expectations and requirements, at the minimum lead time in the market, and to continuously improve the products and services that we offer. For any quality concerns contact: Quality@texasmicroelectronics.com
    ISO 9001:2015 Certificate

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